3D Enterprise NAND extends the Moore's law and provides a higher storage capacity in the same wafer area compared to 2D NAND. The 3D eTLC NAND provides a higher storage density compared to the 3D MLC NAND. The PBlaze5 700 Series SSD enables large scale deployments in the Data Center with lower cost 3D TLC NAND.
The PBlaze5 700 series U.2 2.5-inch form-factor and AIC HHHL have 32 Flash Chips, delivering capacities up to 11TB, 3.4 times the of previous-generation 3.2TB. High density helps save space and power for Data Center, and the large capacity is ready for high-speed data traffic.
16 channels, 32 embedded cores. By offering 1Mililion IOPS and 6GB/s throughput on the HHHL add-in card (AIC), the PBlaze5 700 Series SSD solves IO bottleneck issue in system. This new standard in performance accelerates applications to new levels.
The PBlaze5 700 new MemSpeed 3.0 dynamic smoothing technology ensures consistent performance and meets Tier 1 Data Center service level agreements. The combination of high throughput performance and predictable low latency delivers extreme performance for Data Center applications.
The PBlaze5 700 Series has the best capacity and price ratio and cost performance. For the system with the same storage performance and capacity, PBlaze5 700 series can help reduce the number of nodes, significantly reducing the cluster power consumption. At the same time, hot-pluggable U.2 form factor is available, which can effectively reduce the Data Center operation and maintenance complexity. By deploying the PBlaze5 700 Series NVMe SSD, the Data Center can build high-performance storage systems and solutions while minimizing TCO.
3D Enterprise TLC NAND
Single disk or card capacity up to 11TB
1 Million IOPS, 6GB/s throughput
Ultra-low latency and guaranteed QoS
Hot-pluggable U.2 Form factor available
Databases
Cloud and Hyper-scale computing
High Performance Software-defined Storage
Searching, Indexing, CDN
Deep Learning application and Big Data analytics
3D media rendering
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PBlaze®5 700 Series Spec [1] |
PBlaze5 D700 |
PBlaze5 C700 |
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Form Factor |
2.5-inch U.2 |
HHHL AIC |
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Interface |
PCIe 3.0 x 4 |
PCIe 3.0 x 8 |
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User Capacity (TB) |
2 |
3.6 |
4 |
8 |
11 |
2 |
3.6 |
4 |
8 |
11 |
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Sequential Read (128KB) |
3.5GB/s |
3.5GB/s |
3.5GB/s |
3.5GB/s |
3.5GB/s |
3.9GB/s |
5.3GB/s |
6.0GB/s |
5.6GB/s |
5.3GB/s |
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Sequential Write (128KB) |
1.7GB/s |
2.9GB/s |
3.2GB/s |
3.2GB/s |
3.5GB/s |
1.7GB/s |
2.9GB/s |
3.2GB/s |
3.2GB/s |
3.8GB/s |
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Sustained Random Read (4KB) IOPS |
630K |
835K |
835K |
835K |
835K |
630K |
965K |
1007K |
977K |
977K |
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Sustained Random Write (4KB) IOPS (Steady State) [2] |
72K |
107K |
143K |
143K |
133K |
70K |
109K |
145K |
151K |
142K |
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Latency Read/Write [3] |
94/17μs |
93/16μs |
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Lifetime Endurance [4] |
1 DWPD |
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Uncorrectable Bit Error Rate |
< 10-17 |
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Mean Time Between Failures |
2 million hours |
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Protocol |
NVMe 1.2a |
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NAND Flash Memory |
3D eTLC NAND |
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Operation System |
RHEL, SLES, CentOS, Ubuntu, Windows Server, VMware ESXi |
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Power Consumption |
7 ~ 25w |
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Feature Support |
Power Failure Protection, Hot Pluggable, AES 256 Data Encryption, Full Data Path Protection, S.M.A.R.T, TRIM, Multi-namespace |
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Software Support |
CLI Management Tool, OS in-box driver |
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Certification |
China: CNAS,BSMI, America: FCC Europe: CE, RoHS, WEEE |
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