PBlaze4 supports the industry-standard NVMe 1.1b (Non-Volatile Memory express) interface. Combined with PCIe Gen3, the PBlaze4 series increases IOPS and removes the I/O storage bottleneck that plagues the modern-day data centers.
PBlaze4 750 series comes in a range of capacities, from 800GB to 3.2TB in both 2.5” and Add-in Card (AIC) form factors. To achieve high and consistent performance, MemSpeed® technology set is optimized and utilized on PBlaze4, by delivering superior QoS to handle the most demanding workload spikes of today’s and tomorrow’s data centers.
To ensure Enterprise class data integrity, PBlaze4 incorporates a variety of innovative reliability features which summarized as MemSolid® technology set. Flash memory reliability is ensured through a combination of improved architecture and exceptionally strong ECC, Read Retry and RAID among NANDs technology.
The PBlaze4 2.5’’ form factor adheres to U.2 provisions for hot plug, hot removal and hot swap. PBlaze4 Serials will guarantee the integrity of data both already committed to non-volatile NAND media and cached writes commit to media during hot plug operation.
Utilizing Memblaze’s innovative Device-based Architecture, PBlaze4 can significantly reduce host system overhead (1MB memory occupy). With the flexibility of 2.5’’ form factor, it is effective to reduce deployment time, increase the PCIe SSD density and, save operating expense for data centers and reduce the total cost of ownership (TCO).
|PBlaze4 Series||PBlaze4 C/D750  ||PBlaze4HE C/D750|
|Sequential Read(128KB)||2.4 GB/s||2.9 GB/s||2.9 GB/s||2.9 GB/s||2.8 GB/s||3.0 GB/s|
|Sequential Write (128KB)||700 MB/s||1.4 GB/s||1.4 GB/s||2.3 GB/s||2.3 GB/s||1.6 GB/s|
|Sustained Random Read (4KB) IOPS||600K||740K||740K||700K||700K||750K|
|Sustained Random Write (4KB) IOPS (Steady State / Peek) ||60K/170K||240K/350K||140K/350K||310K/580K||170K/580K||140K / 435K|
|Lifetime Endurance DWPD||3||4||3||4||3||9|
|Latency Read/Write ||96μs / 16μs||96μs / 14μs|
|Uncorrectable Bit Error Rate (UBER)||< 10-17|
|Mean Time Between Failures (MTBF)||2 million hours|
|Form Factor||2.5-inch / HHHL|
|Interface||PCIe 3.0 x 4|
2.5-inch: 61.72mm x 100.20mm x 15.00mm
|NAND Flash Memory||MLC||eMLC，（Global Wear-Leveling）|
|Operation System||RHEL, SLES, CentOS, Ubuntu, Windows Server, VMware ESXi|
|Power Consumption||≤ 25w|
AIC: 0 – 55℃ ambient temperature with suggested airflow
|Software Support||CLI Management Tool, OS in-box driver|
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